| >>Basic characteristics: |
| Name: |
Copper nanoparticles |
Packaging: |
Antistatic plastic bags |
| Molecular Formula: |
Cu |
Appearance: |
Purple & blue powder |
|
| >>Applications: |
| Conductive coatings |
Due to its high conductivity and surface area, copper nanoparticles can be used for EMI shielding and heat sinks. |
| Efficient catalyst |
Cu nanoparticles can serve as catalysts for chemical reactions. Copper can be used as a catalyst for the synthesis of methanol and glycol. |
| Conductive inks and pastes |
Conductive paste and ink from copper can be used as a replacement for more expensive noble metals for printed electronics, displays and other transmissive conductive thin film applications. |
|
| >>Attributes: |
| Product name |
Average particle size
nm |
Diameter Range
nm |
Purity
% |
Specific surface area
m2/g |
Bulk density
g/cm3 |
Shape |
| Copper |
45 |
<100 |
99+ |
30-50 |
0.30-0.35 |
Round |
|
| >>Images: |
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| Copper nanoparticles |
Size distribution(nm) |
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